Oakbury House, Lambourn, Berkshire - RG17 8YG

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Welcome to the IMAPS-UK Homepage

IMAPS - International Microelectronics Assembly & Packaging Society -  is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies. 

The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World!

IMAPS-UK, a registered Charity is the United Kingdom Chapter of the International Microelectronics Assembly & Packaging Society.

Upcoming Events:

Embedded Device Technology

Mitel - 22nd September 2016

Electronic Systems increasingly lie at the heart of the infrastructure and applications we take for granted in everyday life. From mobile phones and tablets through to connected autonomous vehicles, Medical devices, renewable energy controllers and many more. Many of these applications require increased levels of integration and miniaturisation which has traditionally come from Die shrink (Moores Law) and Package integration (MCM, POP ..etc). Embedded Die Technology (EDT) provides an opportunity for high levels of integration at competitive price as alternative to technology such as 2.5D TSV. EDT in particular offers considerable benefits such as high I/O density, multi-die, small footprint and flexible routing.

IMAPS UK in partnership with NMI are delighted to announce this UK first premier Conference on EDT technology which will offer those involved with placement of die and components within the PCB and those involved with Die Package and Interconnection technologies, an opportunity to learn about EDT Technology, Process tools and flows, Materials selection / options, Design - Industrialisation and applications that are being enabled by EDT technology.

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POPc

Heriot-Watt Conference Centre - 22nd - 23rd November 2016

Optoelectronic packaging is one of the current main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To overcome these challenges, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done.

Traditionally, each optoelectronic technology has followed their own packaging roadmaps, technologies, design rules and standards (eg. PIC (Photonic IC), VCSELs, MEMS based sensors, LEDs, etc.). This workshop will explore common challenges between different photonic technologies as well as bring together the entire value chain in order to identify the current bottlenecks and the ways to circumvent them.

Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.

This unique Conference, is jointly organised by:

IMAPS (International Microelectronics, Assembly and Packaging Society, UK Chapter)
JEMI UK (Joint Equipment Materials Initiative)
EPIC (European Photonics Industry Consortium)
SEMI (Semiconductor Equipment and Materials International).

 

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MicroTech - 2017 Annual Conference

Rutherford Appleton Laboratory - 16 March 2017

IMAPS-UK's MicroTech annual conference returns in 2017 on 16 March at Rutherford Appleton Laboratory (RAL), Didcot, near Oxford. With its updated one-day format, MicroTech brings together the entire microelectronics supply chain and is the only UK event dedicated to Micro-Assembly and related technologies.

The conference will feature Keynote talks, technical presentations & table top exhibits on the latest developments, technologies and capabilities, in addition to a high-impact session and poster displays from UK research.

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Important Info

Continuing Professional Development

We are proud to announce that from 2015 we are a CPD member. This represents a big step ahead and a great value for IMAPS-UK members and for all the atendees or our events!

 

 

Why become a member?

Member to member exchange

Expand your contacts

Events & Proceedings

Advancing Microelectronics

Affiliated Membership IMAPS NA

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