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The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical contributions to the electronics packaging industry.

The 2016 William D. Ashman Achievement Award was awarded to Prof. Dr. Dr. Klaus Dieter-Lang for his exceptional contribution to the development of electronic packaging for advanced system-integration. This prestigious award was handed over to Prof. Lang by IMAPS President, Susan Trulli, on October 10, 2017 during the award presentation ceremony at the 50th International Symposium on Microelectronics in Raleigh, NC, USA.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. Prof. Lang has been the director of Fraunhofer IZM since 2011. He is a Fellow, and Life Member of IMAPS, as well as a Senior Member of IEEE.

Wednesday, 07 June 2017 07:30

EMPC 2017 – Where East meets West

With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year's EMPC will be held at the University of Warsaw from September 10 - 13, 2017. As organizers, the Polish IMAPS Chapter cordially invites you to join them as a visitor, exhibitor or sponsor. 

Since it is the first time for the conference to be organized in an eastern part of europe, we look forward to bring together the entire microelectronics supply chain. Technical and marketing professionals should complete the variety of participants, who also move on an important platform for dialogue between industry and academia. 

The conference is dedicated to the growth of the community, focusing on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Reliability and much more. There will be:

- 3 Keynote Sessions

- 14 oral sessions

- 2 poster sessions

The conference offers a great possibility to hear about all the cutting-edge microelectronics news and networking in a relaxed atmosphere during the gala dinner.

We are looking forward to meeting you at the Warsaw University of Technology!

For further information please go to

For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) during the 49th International Symposium on Microelectronics that took place in Pasadena, USA, from Oct. 10 - 14, 2016.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. The Fellow of the Society Award is the highest distinction IMAPS can bestow on a member.

Prof. Schneider-Ramelow has made significant scientific contributions in the field of microelectronic packaging, particularly with regard to the quality and reliability of wire bonds.

Over the years Martin Schneider-Ramelow has been involved with IMAPS in many ways. He has been Chair of IMAPS Germany since 2009 and has made increasing the membership base his particular focus over this period... and very successfully so, as Germany has the largest European chapter with approximately 300 members. 

In September 2015 Martin Schneider-Ramelow was also voted Chair of the European Liaison Committee (ELC) of IMAPS Europe, which means that until 2017 at least he will be responsible for IMAPS both at the German and the European level